EP3C80 Datasheet | Altera Corporation

Description Junction-to-ambient thermal resistance (θJA) with no airflow when a heat sink is not being used. Junction-to-ambient thermal resistance with 100 ft./minute airflow when a heat sink is not being used. Junction-to-ambient thermal resistance with 200 ft./minute airflow when a heat sink is not being used. Junction-to-ambient thermal resistance with 400 ft./minute airflow when a heat sink is not being used. Junction-to-case thermal resistance (θJC) for device. Junction-to-board thermal resistance (θJB) for specific board being used. Table 2 provides θ JA (junction-to-ambient thermal resistance) values and θJC (junction-to-case thermal resistance) values for Cyclone III devices on a board meeting JEDEC specifications for thermal resistance calculation. Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 1 of 2) Device EP3C5 Package E144 F256 U256 M164 θJA (°C/W) Still Air 20 32.4 32.5 38.2 20 32.4 32.5 38.2 θJA (°C/W) 100 ft./min. 17.5 28.9 29.1 31.5 17.5 28.9 29.1 31.5 θ JA (°C/W) 200 ft./min. 15.4 27 27.2 29.6 15.4 27 27.2 29.6 θ JA (°C/W) 400 ft./min. 14 25.5 25.6 27.9 14 25.5 25.6 27.9 θJC (°C/W) 8.4 11.7 12.2 11.6 8.4 11.7 12.2 11.6 EP3C10 E144 F256 U256 M164 DS-CYTHRML-3.0 Altera Corporation .Data Sheet.in Altera Device Package Information Data...