FFM203G
Overview
- Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
- Low profile surface mounted application in order to optimize board space.
- High current capability.
- Fast switching for high efficiency.
- High surge current capability.
- Glass passivated chip junction.
- Lead- free parts meet RoHS requirments.
- Suffix "-H" indicates Halogen-free parts, ex. FFM201-MG-H. Mechanical data
- Epoxy: UL94-V0 rated frame retardant
- Case: Molded plastic, JEDEC DO-214AC / SMA
