FM307G
Key Features
- Batch process design, excellent power dissipation offers. better reverse leakage current and
- Low profile surface mounted application in order to optimize board space
- High current capability
- High surge capability
- Glass passivated chip junction
- Lead-free parts meet environmental standards of
- Suffix "-H" indicates Halogen-free parts, ex. FM301G-H
- Epoxy: UL94-V0 rated flame retardant
- Case : Molded plastic, DO-214AB / SMC
- Terminals : Solder plated, solderable per MIL-STD-750
