MBRS540G
Features
- Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
- Low profile surface mounted application in order to optimize board space.
- Low power loss, high efficiency.
- High current capability, low forward voltage drop.
- High surge capability.
- Guardring for overvoltage protection.
- Ultra high-speed switching.
- Silicon epitaxial planar chip, metal silicon junction.
- Lead-free parts meet environmental standards of
MIL-STD-19500/228
- Suffix "-H" indicates Halogen free parts, ex. MBRS520G-H.
Mechanical data
- Epoxy: UL94-V0 rated frame retardant
- Case: Molded plastic, DO-214AB / SMC
- Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
- Polarity: lndicated by cathode band
- Mounting Position: Any
- Weight: Approximated 0.19 gram
Package outline SMC
0.272(6.9) 0.248(6.3)
0.012(0.3) Typ.
0.189(4.8) 0.165(4.2)
0.048(1.2) Typ.
0.098(2.5) 0.075(1.9)
0.048 (1.2) Typ.
Dimensions in inches and...
