MURA160G
Overview
- Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
- Low profile surface mounted application in order to optimize board space.
- High current capability.
- Ultrafast recovery time for high efficiency.
- High surge current capability.
- Glass passivated chip junction.
- Lead-free parts meet RoHS requirments.
- Suffix "-H" indicates Halogen free parts, ex. MURA105G-H. Mechanical data
- Epoxy:UL94-V0 rated flame retardant
- Case : Molded plastic, JEDEC DO-214AC / SMA
