CSOIC Overview
data sheet Ceramic Small Outline Integrated Circuit Package (CSOIC) This is a ceramic version of the Plastic SOIC package. The CSOIC is a hermetic package consisting of a multilayer ceramic surrounding a "gullwing" formed leadframe. This package has leads extending from two sides of the package (dual).
CSOIC Key Features
- 28 lead count (Others available if supplied and tooled)
- 300 mil body size
- Hermetic solder sealed package
- High thermal conductive ceramic
- Gold lead finish
- "Gullwing" lead form
- JEDEC and EIAJ package outline standard pliant
- Wide selection of cavity sizes to meet most die size needs
- mercial or full Military flows
CSOIC Applications
- 28 lead count (Others available if supplied and tooled)
