Analog Devices LTM3360B
The LTM3360B is offered in a ball grid array (BGA) package, 0.4mm ball pitch, with excellent thermal performance and integrated inductors, input, and output capacitors. The LTM3360B is lead(Pb)-free and RoHS-compliant.| Part No. | LTM3360B |
|---|---|
| Datasheet | LTM3360B Download |
| Manufacturer |  Analog Devices |
| Description | 33A High-Density Step-Down DC-to-DC uModule Regulator |
| Buy | Stock & Price |
FEATURES
● Highest Output Current to Total Solution Footprint (1A/mm2), Integrates all CINs, COUTs, and Inductors● Fast Transient Response
● VIN Range: 2.9V to 5.5V
● VOUT Range: 0.3V to 1V
● Remote Differential Output Sense Pins
● VOUT+ DC accuracy: ±1%
● I2C Serial Interface—Telemetry Readback Includes VOUT, IOUT, VIN, and Die Temperature
● Analog IMON pin for Output Current Monitoring
● Fixed Clock Frequency of 5MHz, External SYNC from 4.5MHz to 5.5MHz
● Parallel Operation: Multiphase up to 12 phases and Stackable to > 1000A
● Advanced Thermally Enhanced 160-Lead, 6.55mm × 5mm × 3.31mm, BGA Package
APPLICATIONS
● Data Centers xPU Core, Application-Specific Integrated Circuit (ASIC), Field-Programmable Gate Array (FPGA) Supplies● Optical Modules
● Industrial and Communications
● Distributed DC Point-of-Load (POL) Power Systems TYPICAL APPLICATION VIN VIN 5V M/S EN VOUT VOUT+ VOUT– 330pF 3kΩ VOUT 0.75V LOAD 2kΩ GND AGND LTM3360B VIN VIN 2kΩ SYNC PGOOD 2kΩ SDA SCL PGND1, PGND2 IRQ IMON 10kΩ Figure 1.
