PM108 Overview
Key Specifications
Description
PM108-000C Low-Input-Current Operational Amplifier PM108R000C Radiation tested Low-Input-Current Operational Amplifier 3.0 Die Information 3.1 Die Dimensions Die Size Die Thickness Bond Pad Metalization 54 mil x 74 mil 19 mil ± 2 mil Al/Cu 3.2 Die Picture 1. I Information furnished by Analog Devices is believed to be accurate and reliable.