APM3095P Datasheet | Anpec Electronics Coropration

Features - -30V/-6A , RDS(ON)=95mΩ(typ.) @ VGS=-10V RDS(ON)=140mΩ(typ.) @ VGS=-4.5V Pin Description - - - Super High Dense Cell Design for Extremely Low R Reliable and Rugged TO-252 Package G D S w w w . D a t a S h e e t 4 U . c o m DS(ON) Top View of TO-252 Applications - Power Management in Notebook puter , Portable Equipment and Battery Powered Systems. Ordering and Marking Information APM 3095P H a n d lin g C o d e Tem p. R ange P a c ka g e C od e P-Channel MOSFET P ackage C ode U : T O -2 5 2 O p e ra tin g J u n c tio n T e m p . R a n g e C : -5 5 to 1 5 0 ° C H a n d lin g C o d e TU : Tube TR : Tape & Reel A P M 3095P U : A P M 3095P XXXXX X X X X X - D a te C o d e Absolute Maximum Ratings Symbol VDSS VGSS ID- IDM Drain-Source Voltage Gate-Source Voltage Parameter (TA = 25°C unless otherwise noted) Rating -30 ±25 -12 -30 A V Unit Maximum Drain Current - Continuous Maximum Drain Current - Pulsed ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright  ANPEC Electronics Corp. Rev. A.1 - Oct., 2002 1 .anpec..tw - Surface Mounted on FR4 Board, t ≤ 10 sec. Absolute Maximum Ratings Cont. Symbol PD Parameter Maximum Power Dissipation TA=25°C TA=100°C TJ TSTG .. (TA = 25°C unless otherwise noted) Rating 50 20 150 -55 to 150 50 W °C °C °C/W Unit Maximum Junction Temperature Storage Temperature Range Thermal Resistance - Junction to Ambient Rθj A Electrical Characteristics Symbol Static BVDSS IDSS VGS(th) IGSS RDS(ON)a VSDa...