APM3195PU Datasheet | Anpec Electronics Coropration

Features - -30V/-11.8A , RDS(ON)=100mΩ (typ.) @ VGS=-10V RDS(ON)=170mΩ (typ.) @ VGS=-4.5V .. Pin Description - - - Super High Dense Cell Design Reliable and Rugged Lead Free Available (Ro HS pliant) Top View of TO-252 Applications - Power Management in Desktop puter or DC/DC Converters P-Channel MOSFET Ordering and Marking Information APM3195P Lead Free Code Handling Code Temp. Range Package Code Package Code U : TO-252 Operating Junction Temp. Range C : -55 to 150 °C Handling Code TU : Tube TR : Tape & Reel Lead Free Code L : Lead Free Device Blank : Original Device XXXXX - Date Code APM3195P U : APM3195P XXXXX Note: ANPEC lead-free products contain molding pounds and 100% matte tin plate termination finish; which are fully pliant with Ro HS and patible with both Sn Pb and lead-free soldiering operations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright © ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 1 .anpec..tw Absolute Maximum Ratings Symbol mon Ratings (TA = 25°C) VDSS VGSS TJ .. Parameter Rating -30 ±20 150 -55 to 150 TC=25°C TC=25°C TC=100°C TC=25°C TC=100°C TC=25°C TC=100°C -8 -20 -15 -11.8 -7.5 50 20 2.5 Unit Drain-Source Voltage Gate-Source Voltage Maximum Junction Temperature Storage Temperature Range Diode Continuous Forward Current V °C °C A TSTG IS Mounted on Large Heat Sink IDP ID PD RθJC 300µs Pulse Drain Current Tested A Continuous Drain Current Maximum Power Dissipation Thermal Resistance-Junction to Case A W °C/W Mounted on PCB of 1in Pad Area IDP ID PD RθJA 300µs Pulse Drain Current Tested Continuous Drain Current Maximum Power Dissipation Thermal Resistance-Junction to Ambient TA=25°C...