AS8FLC1M32 Datasheet | Austin Semiconductor

AUSTIN SEMICONDUCTOR, INC. Austin Semiconductor, Inc. Hermetic, Multi-Chip Module (MCM) 32Mb, 1M x 32, 3.0Volt Boot Block FLASH Array Available via Applicable Specifications: - MIL-PRF-38534, Class H I/O0 I/O1 I/02 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/012 I/O13 I/O14 I/O15 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 FLASH FIGURE 1: PIN ASSIGNMENT (Top View) RESET A0 A1 A2 A3 A4 A5 CS3 GND CS4 WE1 A6 A7 A8 A9 A10 VCC 09 08 07 06 05 04 03 02 01 68 67 66 65 64 63 62 61 60 59 78 57 76 55 54 53 52 51 50 49 Features - - - - - - - - - - - - - - 32Mb device, total density, organized as 1M x 32 Bottom Boot Block (Sector) Architecture Operation with single 3.0V Supply Available in multiple Access time variations Individual byte control via individual byte selects (CSx) Low Power CMOS Minimum 1,000,000 Program/Erase Cycles per sector guaranteed Sector Architecture: - One 16K byte, two 8K byte, one 32K byte and fifteen 64Kbyte sectors Any bination of sectors can be concurrently erased MCM supports full array (multi-chip) Erase Embedded Erase and Program Algorithms Erase Suspend/Resume; Supports reading data from or programming data to a sector not being Erased TTL patible Inputs and Outputs Military and Industrial operating temperature ranges [Package Designator QT] 48 47 46 45 44 I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O24 I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31 I/O8 I/O9 I/O10 A14 A16 A11 A0 A18 I/O0 I/O1 I/O2 VCC A11 A12 A13 A14 A15 A16 CS1 OE CS2 A17 WE2 WE3 WE4 A18 A19 NC Pin Assignment (Top View) Reset CS2 GND I/O11 A10 A9 A15 VCC CS1 A19 I/O3 I/O15 I/O14 I/O13 I/O12 OE A17 WE I/O7 I/O6 I/O5 I/O4 I/O24 I/O25 I/O26 A7 A12 VCC CS4 NC I/O27 A4 A5 A6 NC CS3 GND I/O19 I/O31 I/O30 I/O29 I/O28 A1 A2 A3 I/O23 I/O22 I/O21 I/O20 66 HIP NC A13 A8 I/O16 I/O17 I/O18 .....