Avago Technologies HCPL-M600
The SO-5 JEDEC registered (MO-155) package outline does not require “through holes” in a PCB. This package occupies approximately one fourth the footprint area of the standard dual-in-line package.DESCRIPTION
These small outline high CMR, high speed, logic gate optocouplers are single channel devices in a five lead miniature footprint. They are electrically equivalent to the following Avago optocouplers (except there is no output enable feature): SO-5 Package HCPL-M600 HCPL-M601 HCPL-M611 Standard DIP 6N137 HCPL-2601 HCPL-2611 SO-8 Package HCPL-0600 HCPL-0601 HCPL-0611 The lead profile is designed to be compatible with standard surface mount processes.FEATURES
● Surface Mountable● Very Small, Low Profile JEDEC Registered Package Outline
● Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes
● Internal Shield for H