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HCPL-M601 - Logic Gate Optocouplers

Download the HCPL-M601 datasheet PDF. This datasheet also covers the HCPL-M600 variant, as both devices belong to the same logic gate optocouplers family and are provided as variant models within a single manufacturer datasheet.

General Description

These small outline high CMR, high speed, logic gate opto­coup­lers are single channel devices in a five lead miniature foot­print.

Key Features

  • Surface Mountable.
  • Very Small, Low Profile JEDEC Registered Package Outline.
  • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes.
  • Internal Shield for H.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (HCPL-M600-Avago.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

Part Number Description Manufacturer
HCPL-M601 Logic Gate Optocouplers Agilent
HCPL-M600 Logic Gate Optocouplers Agilent
HCPL-M611 Logic Gate Optocouplers Agilent
HCPL-M452 High Speed Optocouplers Agilent
HCPL-M452 High-Speed Optocouplers Broadcom

Other Datasheets by Avago Technologies (now Broadcom)

Part Number Description
HCPL-M600 Logic Gate Optocouplers
HCPL-M611 Logic Gate Optocouplers
HCPL-0201 Logic Gate Optocouplers
HCPL-0211 Logic Gate Optocouplers
HCPL-0302 (HCPL-3020 / HCPL-0302) 0.4 Amp Output Current IGBT Gate Drive Optocoupler

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
HCPL-M600, HCPL-M601, HCPL-M611 Small Outline, 5 Lead, High CMR, High Speed, Logic Gate Optocouplers Data Sheet Description These small outline high CMR, high speed, logic gate opto­coup­lers are single channel devices in a five lead miniature foot­print. They are electrically equivalent to the following Avago optocouplers (except there is no output enable feature): SO-5 Package HCPL-M600 HCPL-M601 HCPL-M611 Standard DIP 6N137 HCPL-2601 HCPL-2611 SO-8 Package HCPL-0600 HCPL-0601 HCPL-0611 The SO-5 JEDEC registered (MO-155) package outline does not require “through holes” in a PCB. This package occupies approximately one fourth the footprint area of the standard dual-in-line package. The lead profile is designed to be com­patible with standard surface mount processes.