BG314 Description
1 V10 Oct13，2013 The First Version 2 V11 May17，2014 Change Module Pad Size 3 V12 July09，2014 Change Module Pad Size Ver:12 2/9 DESCRIPTION 博昊科技有限公司 BOUGH TECHNOLOGY PANY LIMITED Room626-630,F Building,Digital Silicon Valley Industrial Park,HengPing Road.