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HC1000 Datasheet Gel-like Modulus Gap Filling Material

Manufacturer: Bergquist

Overview: Gap Pad® HC1000 “Gel-Like” Modulus Gap Filling Material Resultant Thickness (mils) Section A Section B Section C Section D Section.

Datasheet Details

Part number HC1000
Manufacturer Bergquist
File Size 52.46 KB
Description Gel-Like Modulus Gap Filling Material
Datasheet HC1000-Bergquist.pdf

Key Features

  • Thermal conductivity: 1.0 W/m-K.
  • Highly conformable, low hardness.
  • “Gel-like” modulus.
  • Fiberglass reinforced for puncture, shear and tear resistance Gap Pad HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. Gap Pad HC1000 is offered.

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