HC1000 Description
Gap Pad® HC1000 “Gel-Like” Modulus Gap Filling Material Resultant Thickness (mils) Section A Section B Section C Section D Section.
HC1000 Key Features
- Thermal conductivity: 1.0 W/m-K
- Highly conformable, low hardness
- Fiberglass reinforced for puncture
- Thickness (inch) / (mm)
- 76 to 392
- 60 to 200
- ELECTRICAL Dielectric Breakdown Voltage (Vac)