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Gap Pad® HC1000
“Gel-Like” Modulus Gap Filling Material
Resultant Thickness (mils)
Section A Section B Section C Section D Section E
Features and Benefits
• Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus • Fiberglass reinforced for puncture,
shear and tear resistance
Gap Pad HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks.The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. Gap Pad HC1000 is offered with removable protective liners on both sides of the material.
Note: Resultant thickness is defined as the final gap thickness of the application.
20 18 16 14 12 10
0.
HC1000 Datasheet
