BME680 Overview
Product photos and pictures are for illustration purposes only and may differ from the real product appearance. Modifications reserved |Data subject not change without notice | Printed in Germany Document number: The sensor module is housed in an extremely pact metal-lid LGA package with a footprint of only 3.0 × 3.0 mm² with a maximum height of 1.00 mm (0.93 ± 0.07.