SOT23-5 Description
PACKAGE MECHANICAL INFORMATION SOT23-5 Package Outline Dimensions This surface mount package consists of a chip mounted on a leadframe and fully encapsulated in an epoxy mold pound. With Pb-Free terminations, this package meets the requirements of IPC/Jedec J-STD-20, moisture level 1 at 260 °C. 5-Pin Plastic Small Outline Surface Mount MO-178, AA, JEDEC 95 1.90 TYP.