SMBJ3.3A
Features
- For surface mounted applications in order to optimize board space
- Low profile package
- Built-in strain relief
- Low inductance
- Excellent clamping capability
- 600W peak pulse power capability at 10/1000μs waveform, repetitionrate (duty cycle):0.01%
- Fast response time
- Typical IR less than 200μA
- High Temperature soldering: 260℃/10 seconds at terminals
- Plastic package has underwriters laboratory flammability 94V-0
- Meets MSL level 1, per J-STD-020
- Safety certification: UL: E465643
Mechanical Data
- Case: JEDEC DO-214AA.
- Terminal: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes cathode
- Standard Packaging: 12mm tape (EIA STD RS-481)
- Weight: 0.10g
Applications
- I/O interface
- Power supply
Maximum Ratings and Characteristics
Ratings at 25℃ ambient temperature unless otherwise specified.
Rating
Symbol
Value
Units
Peak pulse power dissipation at 10/1000μs waveform (Note1, Note2, Fig.1)
PPPM
Minimum 600...
