DESCRIPTION
These devices consist of a sigma-delta analog-to-digital converter optically coupled to a digital-to-analog converter in a hermetically sealed package. The products are capable of operation and storage over the full military temperature range and can be purchased as a commercial product (HCPL-7850), with full MIL-PRF-38534 Class H testing (HCPL-7851), with MIL-PRF-38534 Class E testing (ACPL-785E) (Class K with exceptions) or from the DLA Standard Microcircuit Drawing (SMD) 5962-97557. Details of the Class E program exceptions are listed here: 1. Nondestructive Bond Pull, Test method 2023 of MIL-STD-883 in screening is not required. 2. Particle Impact Noise Detection (PIND), Test method 2020 of MIL-STD-883 in device screening and group C testing is not required. 3. Die Shear Strength, Test method 2019 of MIL-STD-883 in group B testing is not required. 4. Internal Water Vapor Content, Test method 1018 of MIL-STD-883 in group C is not required. 5. Scanning Electron Microscope (SEM) inspection, Test method 2018 of MIL-STD-883 in element evaluation is not required.
Broadcom
