• Part: HLMP-Q102
  • Description: Subminiature High-Performance Red LED Lamps
  • Manufacturer: Broadcom
  • Size: 521.84 KB
HLMP-Q102 Datasheet (PDF) Download
Broadcom
HLMP-Q102

Key Features

  • Subminiature flat-top package
  • Ideal for backlighting and light piping applications
  • Subminiature dome package - Diffused dome for a wide viewing angle - Nondiffused dome for high brightness
  • Wide range of drive currents: 500 mA to 50 mA
  • Ideal for space-limited applications
  • Axial leads
  • Available with lead configurations for surface-mount and through-hole PC board mounting Lead Configurations All of these devices are made by encapsulating LED chips on axial lead frames to form molded epoxy subminiature lamp packages. A variety of package configuration options are available. These include special surface-mount lead configurations, gull wing, yoke lead, or Z-bend. Right-angle lead bends at 2.54-mm (0.100-in.) and 5.08-mm (0.200-in.) center spacing are available for through-hole mounting. For additional information, refer to the Standard SMT and Through-Hole Lead Bend Options for Subminiature LED Lamps Data Sheet. Broadcom