HLMP-Q102
Key Features
- Subminiature flat-top package
- Ideal for backlighting and light piping applications
- Subminiature dome package - Diffused dome for a wide viewing angle - Nondiffused dome for high brightness
- Wide range of drive currents: 500 mA to 50 mA
- Ideal for space-limited applications
- Axial leads
- Available with lead configurations for surface-mount and through-hole PC board mounting Lead Configurations All of these devices are made by encapsulating LED chips on axial lead frames to form molded epoxy subminiature lamp packages. A variety of package configuration options are available. These include special surface-mount lead configurations, gull wing, yoke lead, or Z-bend. Right-angle lead bends at 2.54-mm (0.100-in.) and 5.08-mm (0.200-in.) center spacing are available for through-hole mounting. For additional information, refer to the Standard SMT and Through-Hole Lead Bend Options for Subminiature LED Lamps Data Sheet. Broadcom
