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HSMF-C116 - Ultra Small Surface Mount Tricolor ChipLED

General Description

This ultra-small tricolor chipLED is designed for close pitch assembly and also for portable and wearables applications.

The package uses high intensity red AlInGaP die and high intensity InGaN green and blue die.

To improve contrast the PCB substrate has a black surface.

Display

Key Features

  • LED with AlInGaP and InGaN die.
  • Surface mount device with ultra small 1.0 × 1.0mm footprint.
  • Suitable for.

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Datasheet Details

Part number HSMF-C116
Manufacturer Broadcom
File Size 590.37 KB
Description Ultra Small Surface Mount Tricolor ChipLED
Datasheet download datasheet HSMF-C116 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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HSMF-C116 Ultra Small Surface Mount Tricolor ChipLED Data Sheet Description This ultra-small tricolor chipLED is designed for close pitch assembly and also for portable and wearables applications. The package uses high intensity red AlInGaP die and high intensity InGaN green and blue die. To improve contrast the PCB substrate has a black surface. Applications  Display  Backlighting  Indicator Features  LED with AlInGaP and InGaN die  Surface mount device with ultra small 1.0 × 1.0mm footprint  Suitable for application that requires small pitch size  Compatible with reflow soldering  Taped in 8mm carrier tape on a 7 inch diameter reel Package Dimensions Pin4 1.05 Pin1 0.65 B G 1.05 R Pin3 Pin2 Resin PCB Pin1 (0.3) 0.29 Pin2 Pin4 0.