HSMF-C116 Overview
Description
This ultra-small tricolor chipLED is designed for close pitch assembly and also for portable and wearables applications. The package uses high intensity red AlInGaP die and high intensity InGaN green and blue die.
Key Features
- LED with AlInGaP and InGaN die
- Surface mount device with ultra small 1.0 × 1.0mm footprint
- Suitable for application that requires small pitch size
- Compatible with reflow soldering
