Broadcom HSMF-C116
This ultra-small tricolor chipLED is designed for close pitch assembly and also for portable and wearables applications. The package uses high intensity red AlInGaP die and high intensity InGaN green and blue die.| Part No. | HSMF-C116 |
|---|---|
| Datasheet | HSMF-C116 Download |
| Manufacturer |  Broadcom |
| Description | Ultra Small Surface Mount Tricolor ChipLED |
| Buy | Stock & Price |
DESCRIPTION
To improve contrast the PCB substrate has a black surface.APPLICATIONS
● Display● Backlighting
● Indicator
FEATURES
● LED with AlInGaP and InGaN die● Surface mount device with ultra small 1.0 × 1.0mm footprint
● Suitable for application that requires small pitch size
● Compatible with reflow soldering
● Taped in 8mm carrier tape on a 7 inch diameter reel Package Dimensions Pin4 1.05 Pin1 0.65 B G 1.05 R Pin3 Pin2 Resin PCB Pin1 (0.3) 0.29 Pin2 Pin4 0.29 B GR Pin4 Pin3 Pin2 Pin3 Pin1 NOTE All dimensions in millimeters. Tolerance is ±0.1 mm unless otherwise specified. CAUTION This LED is class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate pr
