HSMF-C116 Overview
This ultra-small tricolor chipLED is designed for close pitch assembly and also for portable and wearables applications. The package uses high intensity red AlInGaP die and high intensity InGaN green and blue die. To improve contrast the PCB substrate has a black surface.
HSMF-C116 Key Features
- LED with AlInGaP and InGaN die
- Surface mount device with ultra small 1.0 × 1.0mm
- Suitable for application that requires small pitch size
- patible with reflow soldering
- Taped in 8mm carrier tape on a 7 inch diameter reel