SS10PU200
FEATURES
Very low profile
- typical height of 1.1 mm Ideal for automated placement Low forward voltage drop, low power losses High efficiency Low thermal resistance Meets MSL level 1, per J-STD-020 Solder dip 260 °C max. 10 s, per JESD 22-A111 pliant to Ro HS directive 2002/95/EC and in accordance to WEEE 2002/96/EC MECHANICAL DATA Case: Conform to JEDEC TO-277A; Suffix /A Industry TO-277B; Suffix /B Molding pound meets UL 94 V-0 flammability
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Maximum Ratings (Tc=25°C unless otherwise noted)
Parameter Maximum repetitive peak reverse voltage Working peak reverse voltage Maximum DC blocking voltage Maximum average forward rectified current Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Non-repetitive avalanche energy at 25 °C IAS = 2 A per diode Operating junction temperature range Storage temperature range
Note: (1) Mounted on 30 mm x 30 mm Al P.C.B. with 50 mm x 25 mm x 100 mm fin heat...
