SS10PU50A - High Current Density Surface Mount Schottky Rectifi
Bruckewell Technology
Key Features
Very low profile - typical height of 1.1 mm Ideal for automated placement Low forward voltage drop, low power losses High efficiency Low thermal resistance Meets MSL level 1, per J-STD-020 Solder dip 260 °C max. 10 s, per JESD 22-A111 Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC.
High Current Density Surface Mount Schottky Rectifi
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Bruckewell Technology Corp., Ltd.
High Current Density Surface Mount Schottky Rectifier SS10PU50/ A/B FEATURES
Very low profile - typical height of 1.1 mm Ideal for automated placement Low forward voltage drop, low power losses High efficiency Low thermal resistance Meets MSL level 1, per J-STD-020 Solder dip 260 °C max. 10 s, per JESD 22-A111 Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Case: Conform to JEDEC TO-277A; Suffix /A Industry TO-277B; Suffix /B Molding compound meets UL 94 V-0 flammability
Maximum Ratings (Tc=25°C unless otherwise noted) Parameter Maximum repetitive peak reverse voltage Working peak reverse voltage Maximum DC blocking voltage Maximum average forward rectified current Total device Peak forward surge current 8.
SS10PU50A Datasheet
