MS9N20E Overview
These miniature surface mount MOSFETs utilize a high cell density trench process to provide low rDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are DC-DC converters and power management in portable and battery-powered products such as puters, printers, PCMCIA cards, cellular and cordless telephones.
MS9N20E Key Features
- Low rDS(on) provides higher efficiency and extends battery life
- Low thermal impedance copper leadframe
- DFN2X5 6PP saves board space
- Fast switching speed
- High performance trench technology Packing &
MS9N20E Applications
- Low rDS(on) provides higher efficiency and extends battery life