SS12PU120S
Key Features
- Very low profile - typical height of 1.1 mm
- Ideal for automated placement
- Low forward voltage drop, low power losses
- High efficiency
- Low thermal resistance
- Meets MSL level 1, per J-STD-020
- Solder dip 260 °C max. 10 s, per JESD 22-A111
- RoHS compliant package Application ‧ DC/DC Converters ‧ AC/DC Adaptors Mechanical Data
- Case: Conform to JEDEC TO-277A; Suffix /A Industry TO-277B; Suffix /B
- Molding compound meets UL 94 V-0 flammability Packing & Order Information 3,000/Reel TO-277A TO-277B
