UF1D Datasheet | CHENG-YI

FEATURES For surface mounted applications Low profile package Built-in strain relief Easy pick and place Ultrafast recovery times for high efficiency Plastic package has Underwriters Laboratory Flammability Classification 94V-O Glass passivated junction High temperature soldering 260o C/10 seconds at terminals MECHANICAL DATA Case: JEDEC DO-214AA molded plastic Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Indicated by cathode band Standard Packaging: 12mm tape (EIA-481) Weight: 0.003 ounces, 0.093 gram .075(1.91) .083(2.11) .130(3.30) .155(3.94) .083(2.13) .096(2.44) .030(0.76) .050(1.27) .160(4.06) .185(4.70) .006(.152) .012(.305) .002(.051) .008(.203) .200(5.08) .220(5.59) Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 250C ambient temperature unless...