B2200WG-SL Overview
Key Features
- Low profile surface mounted application in order to optimize board space
- Low power loss, high efficiency
- High current capability, low forward voltage drop
- Ultra high-speed switching
- Silicon epitaxial planar chip, metal silicon junction
- Lead free in compliance with EU RoHS
- Mechanical data
- Epoxy:UL94-V0 rated flame retardant
- Case : Molded plastic, SOD-123SL
- Terminals : Solder plated, solderable per MIL-STD-750, Method 2026
