Part ES3GB
Description Super Fast Rectifier
Manufacturer Chip Integration Technology
Size 51.41 KB
Chip Integration Technology
ES3GB

Overview

  • Low profile surface mounted application in order to optimize board space.
  • High current capability, low forward voltage drop.
  • High surge capability.
  • Superfast recovery time for switching mode application.
  • Glass passivated chip junction.
  • Suffix "G" indicates Halogen free parts, ex. ΕS3ΑΒG.
  • Lead-free parts meet environmental standards of