Part SK26B
Description 2A Surface Mount Schottky Barrier Rectifiers
Manufacturer Chip Integration Technology
Size 139.31 KB
Chip Integration Technology
SK26B

Overview

  • Electrostatic discharge (ESD) test under IEC6100-4-2 standard >16ΚV(SK22B~SK26B). standard >10ΚV(SK210B~SK220B).
  • Low profile surface mounted application in order to optimize board space.
  • Low power loss, high efficiency.
  • High current capability, low forward voltage drop.
  • Ultra high-speed switching.
  • Silicon epitaxial planar chip, metal silicon junction.
  • Suffix "G" indicates Halogen-free part, 22BG.
  • Lead-free parts meet environmental standards of