Part TC1211LC
Description ESD Protection Device
Manufacturer Chip Integration Technology
Size 481.55 KB
Chip Integration Technology
TC1211LC

Overview

  • Uni-directional ESD protection.
  • Surface mount package.
  • Ultra small SMD package:0402.
  • High component density.
  • Mechanical data
  • Case : 0402/SOD-923F standard package,molded plastic.
  • Terminals : Gold plated, solderable per MIL-STD-750 Method 2026
  • Μarking Code : Cathode band & E2
  • Mounting position : Any.
  • Weight : 0.001 grams(Approx).