• Part: CMX868A
  • Description: Low Power V.22 bis Modem
  • Manufacturer: CML
  • Size: 1.35 MB
Download CMX868A Datasheet PDF
CML
CMX868A
CMX868A is Low Power V.22 bis Modem manufactured by CML.
Features - V.22 bis 2400/2400 bps QAM - V.22, Bell 212A 1200/1200 or 600/600 bps DPSK - V.23 1200/75, 1200/1200, 75, 1200 bps FSK - Bell 202 1200/150, 1200/1200, 150, 1200 bps FSK - V.21 or Bell 103 300/300 bps FSK - DTMF/Tones Transmit and Receive - ‘Powersave’ Standby Mode Low Power V.22 bis Modem Applications - Telephone Telemetry Systems - Remote Utility Meter Reading - Security Systems - Industrial Control Systems - Electronic Cash Terminals - Pay-Phones - Set-Top Boxes 1. Brief Description The CMX868A is a multi-standard modem for use in telephone based information and telemetry systems. Control of the device is via a simple high speed serial bus, patible with most types of µC serial interface. The data transmitted and received by the modem is also transferred over the same serial bus. On-chip programmable Tx and Rx USARTs meeting the requirements of V.14 are provided for use with asynchronous data and allow unformatted synchronous data to be received or transmitted as 8-bit words. A high-quality DTMF decoder with excellent immunity to falsing on voice and a standard DTMF encoder are included. Alternatively, these blocks can be used to transmit and detect user-specific, programmed single and dual-tone signals, call progress signals or modem calling and answering tones. Flexible line driver and receive hybrid circuits are integrated on chip, requiring only passive external ponents to build a 2 or 4-wire line interface. The device also features a hook switch relay drive output and a Ring Detector circuit which continues to function when the device is in the Powersave mode, providing an interrupt which can be used to wake up the host µController when line voltage reversal or ringing is detected. The CMX868A operates from a single 2.7 to 5.5V supply over a temperature range of -40°C to +85°C and is available in 24-pin TSSOP, SOIC and DIP packages. © 2008 CML Microsystems Plc Low Power V.22 bis Modem Section CONTENTS Page 1. Brief...