CREE UT190
The above ratings were determined using a thru-hole package (with Hysol® OS4000 encapsulant) for characterization. The forward currents (DC and Peak) are not limited by the die but by the effect of the LED junction temperature on the package.APPLICATIONS
include consumer products, mobile devices and automotive applications where a small, thin form factor is required.FEATURES
● Wavelengths for Blue, Green and White-conversion● 50 mm Chip Thickness
● RF Performance: – 450 nm – 12+ mW – 460 nm – 10+ mW – 470 nm – 10+ mW – 527 nm – 4+ mW
● Low Forward Voltage – 2.9 V Typical at 5 mA
● Conductive Adhesive Die Attach
● Single Wire Bond, Vertically Conductive Structure
● 2kV Class 2 ESD Rating CxxxUT190-Sxxxx-31 Chip Diagram
APPLICATIONS
● IndicatorAPPLICATIONS
– Consumer Products – Mobile Devices – Product Displays – White Goods● Automotive
APPLICATIONS
– Interior Indicators – Meter Cluster Lighting – Center Stack Displays Top View Anode (+), Ф85 mm (Bonding area, Ф70 mm) Junction, 160 x 160 mm Thickness, 50 mm Side View 190 x 190 mm Cathode (-) 80 x 80 mm Bottom Surface 150 x 150 mm Bottom View Subject to change without notice. 1 Data Sheet: CPR3EP Rev DMAXIMUM RATINGS
at TA = 25°C Notes 1&3 DC Forward Current Peak Forward...