741X083
Key Features
- Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits Concave and Convex Options RoHS compliant Version Available
- High Density Packaging Up to 30% less space per resistor than 0603 chip resistors Up to 75% less space per resistor than 0805 chip resistors Placement Efficiency Networks require fewer placements than discrete ponents Larger overall size eases handling pared to discrete ponents Low Profile; Can be used in PCMCIA cards Electrical and Mechanical Specifications
