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8/05/02
R
Series 741, 742, 743, 744, 745, 746
Technical
THICK FILM CHIP RESISTOR ARRAYS
* Low cost * High density packaging * Leadless surface mount construction * Tape & reel packaging * Solder coated nickel barrier pads * Isolated and bussed circuits * Convex or Concave Termination Options
Chip Array Product Benefits
* High Density Packaging Up to 30% less space per resistor than 0603 chip resistors Up to 75% less space per resistor than 0805 chip resistors * Placement Efficiency Networks require fewer placements than discrete components Larger overall size eases handling compared to discrete components * Low Profile Can be used in PCMCIA cards * Perfect solution for DRAM series termination or Pull up/down signal bias.