SMA4729A Datasheet | CYStech Electronics

Features - Glass passivated chip - Low leakage - Built in strain relief - Low inductance - High peak reverse power dissipation - Lead ( Pb) free ponents - For use in stabilizing and clipping with high power rating Mechanical Data - Case : JEDEC DO-214AC(SMA) molded plastic body - Epoxy: UL 94V-0 rate flame retardant - Lead: Solderable per MIL-STD-750, method 2026 - Polarity : Color band denotes cathode end - Mounting position : Any Outline DO-214AC (SMA) Maximum Ratings (TA=25C, unless otherwise noted) Parameter Symbol DC power dissipation at TL=50°C (Note 1) Maximum forward voltage at IF=200m A Maximum thermal resistance, junction-to-ambient (Note 2) RJA Operating junction and storage temperature range TJ;TSTG Notes: 1. TL=lead temperature at 3/8” (9.5mm)...