SMA4734A
Overview
- Glass passivated chip
- Low leakage
- Built in strain relief
- Low inductance
- High peak reverse power dissipation
- Lead ( Pb) free components
- For use in stabilizing and clipping with high power rating Mechanical Data
- Case : JEDEC DO-214AC(SMA) molded plastic body
- Epoxy: UL 94V-0 rate flame retardant
- Lead: Solderable per MIL-STD-750, method 2026
