MP725 Datasheet PDF

APPLICATIONS

Engineering. Measurement Note: For the specifications, resistance measurement shall be made at the foot of surface mount formed terminal. FOOTPRINT FOR SOLDERABLE CONTACT AREA .310 (7.87) PACKAGE DIMENSIONS .320 ±.010 (8.13 ±.26) .250 (6.35) .325 ±.020 (8.26 ±.51) .040 ±.018 (1.02 ±.46) .110 ±.010 (2.79 ±.26) .032 ±.003 (.81 ±.08) .275 (6.99) Heat sink height .053 ± .007 (1.35 ± .18) .200 ±.010 (5.08 ±.26) .058 ±.007 (1.47 ±.18) .025 ±.004 (.64 ±.10) .160 ±.010 (4.06 ±.26) .070 ±.010 (1.78 ±.26) .335 (8.51) Scale: 1.5X .070 (1.78) .150 (3.81) .100 (2.54) .065 (1.65) .100 (2.54) .065 (1.65) MP 725 10.0 1% .030 ± .004 (.76 ± .10) Dimensions in inches