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CSPST08 - CHIP SCALE SERIES TERMINATION ARRAY

Datasheet Summary

Description

The CSPST is a high performance Integrated Passive Device (IPD) which provides series terminations suitable for use in high speed bus applications.

Eight (8) or sixteen (16) series termination versions are provided.

Features

  • 8 or 16 integrated high frequency series terminations.
  • Ultra small footprint Chip Scale Package.
  • Ceramic substrate.
  • 0.35mm Eutectic Solder Bumps, 0.65mm pitch.

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Datasheet Details

Part number CSPST08
Manufacturer California Micro Devices Corp
File Size 49.83 KB
Description CHIP SCALE SERIES TERMINATION ARRAY
Datasheet download datasheet CSPST08 Datasheet
Additional preview pages of the CSPST08 datasheet.

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Full PDF Text Transcription

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CALIFORNIA MICRO DEVICES Chip Scale Series Termination Array Features • 8 or 16 integrated high frequency series terminations • Ultra small footprint Chip Scale Package • Ceramic substrate • 0.35mm Eutectic Solder Bumps, 0.65mm pitch Applications • Series resistive bus termination • Isolated resistor array CSPST Product Description The CSPST is a high performance Integrated Passive Device (IPD) which provides series terminations suitable for use in high speed bus applications. Eight (8) or sixteen (16) series termination versions are provided. These resistors provide excellent high frequency performance in excess of 3GHz and are manufactured to an absolute tolerance as low as ±1%.
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