CM1206 Datasheet | California Micro Devices

.. ESD Protection Arrays, Chip Scale Package Features - - - - Functionally and pin patible with CMD’s PACDN2404C/08C/16C family of devices Opti Guard™ coated for improved reliability at assembly 4, 8, or 16 transient voltage suppressors in a single package In-system Electrostatic Discharge (ESD) protection to +18k V contact discharge per IEC 61000-4-2 international standard Supports AC signal applications pact Chip Scale Package (0.65mm pitch) format saves board space and eases layout in space critical applications pared to discrete solutions and traditional wire bonded packages Lead-free versions available Product Description The CM1206 family of transient voltage suppressor arrays provides a very high level of protection for sensitive electronic ponents that may be subjected to ESD. The back-to-back Zener connections provide ESD protection in cases where nodes with AC signals are present. These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000-4-2 international standard. All I/Os are rated at +18k V using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than +30k V. The Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. The CM1206 incorporates Opti Guard™ coating which results in improved reliability at assembly. The CM1206 is also available with optional lead-free finishing. - - - Applications - - - - - - - - ESD protection for sensitive electronic equipment I/O port, keypad and button circuitry protection for portable devices Wireless Handsets Handheld PCs / PDAs MP3...