CSPRC032A Datasheet | California Micro Devices

CSPRC032A 4 Channel EMI Filter Network Features - - - - - - - 4 EMI filter lines per device Filters attenuate to - 30d B at 3GHz CSP package minimizes cross-talk 9-bump 2.485mm X 0.985mm Chip Scale Package (CSP), 0.5mm pitch 0.30mm Eutectic solder bumps Ultra small footprint suitable for portable devices Lead-free version available Product Description The CSPRC032A is a 4-channel low pass EMI filter (RC-R configuration) in a Chip Scale Package (CSP). Many portable applications require the attenuation of signals in the 800-3000 MHz band. California Micro Devices’ unique thin film technology provides a minimum of - 25d B of attenuation over this frequency band. The bump size and pitch of these filters are selected such that the device can be placed directly on an FR4 printed circuit board using conventional assembly techniques. The pin-out for the device Features a signal ‘flow through’ design, allowing optimal signal routing. The solder bump contacts are a 63/37 Sn/Pb alloy (Sn/ Ag/Cu for lead-free finish) and are 0.30 mm in diameter. The CSPRC032A is available in a space-saving, lowprofile Chip Scale Package with optional lead-free finishing. Applications - - - - - - EMI filtering for RF sections of wireless devices Cellular phones Cordless phones Internet appliances PDAs Laptop puters Electrical Schematic A1 50Ω R 50Ω C R 43p F GND 50Ω C R 43p F GND B3 B2 B1 A2 50Ω R A4 50Ω R 50Ω C R 43p F B4 .. A5 50Ω R 50Ω C R 43p F B5 © 2005 California Micro Devices Corp. All rights reserved. 11/09/05 490 N. Mc Carthy Blvd., Milpitas, CA 95035-5112 - Tel: 408.263.3214 - Fax:...