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CP208 - Power Transistor NPN - Amp/Switch Transistor Chip

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www.DataShePet4RU.OcomCESS CP208 Power Transistor NPN - Amp/Switch Transistor Chip CentralTM Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY EPITAXIAL BASE 66 X 66 MILS 12.5 ± 1.0 MILS 12 X 24 MILS 11 X 14 MILS Al - 50,000Å Cr/Ni/Ag - 16,000Å GROSS DIE PER 4 INCH WAFER 2,630 PRINCIPAL DEVICE TYPES CJD31C MJE182 TIP31C BACKSIDE COLLECTOR 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com R2 (1-August 2002) CentralTM www.DataSheet4U.com Semiconductor Corp. PROCESS CP208 Typical Electrical Characteristics 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.