CMS-S050-040
Key Features
- Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A):
- 270 * 1.270 mm 2 Bond Pad size(B) :
- 143 *1.143 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Metalization : Cathode Ti/Ni/Ag
