CBM4083
CBM4083 is CBM4083 manufactured by Chipsbank.
Wafer Specification
Rev 1.0
CBM4083 Wafer Specification
- 1
- 04/12/2009
Date 2009-12-04
Revision History
Rev No 1.0
Description Initial release
CBM4083 Wafer Specification
- 2
- 04/12/2009
Contents
1 PAD CONFIGURATION...............................................................................................................4 2 DIE INFORMATION TABLE ........................................................................................................4 3 CHIP WINDOWS SIZE ................................................................................................................5 4 PAD INFORMATION TABLE.......................................................................................................5 5 COPYRIGHT NOTICE .................................................................................................................7
CBM4083 Wafer Specification
- 3
- 04/12/2009
1 PAD Configuration
2 Die Information Table
Die Size PAD Pitch Typical PAD Size Special PAD Size
1583.52 X 1690.44 um 76 um
66 × 70.4 um 11pin,13pin(158×70.4 um);12pin(244×70.4 um);15pin(309×70.4 um).
CBM4083 Wafer Specification
- 4
- 04/12/2009
3 Chip Windows Size
Top Left Corner (um)
Bottom Left Corner(um)
( -11.17, 1679.27 ) ( -11.17, -11.17 )
Top Right Corner(um) Bottom Right Corner...
