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CPC1967 - Power Relay

General Description

Clare and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of high power Solid State Relays.

Key Features

  • a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation, but also very low thermal resistance (0.35 °C/W). Features.
  • 3.35Arms Load Current with 5°C/W Heat Sink Low 0.85Ω On-Resistance 400VP Blocking Vol.

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Datasheet Details

Part number CPC1967
Manufacturer Clare
File Size 912.05 KB
Description Power Relay
Datasheet download datasheet CPC1967 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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i4-PAC™ Power Relay Characteristics Parameter Blocking Voltage Load Current, TA=25°C: With 5°C/W Heat Sink No Heat Sink On-Resistance RθJC 3.35 1.35 0.85 0.35 Arms Ω °C/W CPC1967 Description Rating 400 Units VP Clare and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of high power Solid State Relays. As part of this family, the CPC1967 single-pole normally open (1-Form-A) Solid State Power Relay is rated for up to 3.35Arms continuous load current with a 5°C/W heat sink. The CPC1967 employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation.