Description
Clare and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of high power Solid State Relays.
Features
- a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation, but also very low thermal resistance (0.35 °C/W). Features.
- 3.35Arms Load Current with 5°C/W Heat Sink Low 0.85Ω On-Resistance 400VP Blocking Vol.
CPC1967 Datasheet
