PLA110 Key Features
- Small 6 Pin DIP Package
- Low Drive Power Requirements (TTL/CMOS
- No Moving Parts
- High Reliability
- Arc-Free With No Snubbing Circuits
- 3750VRMS Input/Output Isolation
- FCC patible
- VDE patible
- No EMI/RFI Generation
- Machine Insertable, Wave Solderable
