6K24-G Datasheet | Comchip Technology

Features : Designed for under the hood applications Plastic package has underwriters laboratory Flammability classification 94V-0 Exclusive patented PAR® oxide passivated chip construction Low incremental surge resistance Ideally suited for automotive “load dump” applications High temp. soldering guaranteed: 300ºC/10 seconds, 0.375" (9.5mm) lead length, 5lbs. (2.3kg) tension P600 1.0(25.4) MIN. 0.360 (9.1) 0.340 (8.6) 0.360 (9.1) 0.340 (8.6) Mechanical Data: Case: Molded plastic body over nitride passivated die Terminals: Axial leads solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes positive end (cathode) Weight: 0.07oz., 2.1g Mounting Position: Any 0.052 (1.32) 0.048 (1.22) 1.0(25.4) MIN. Dimensions in inches and (millimeters) .. Maximum Ratings and Thermal Characteristics (TA=25ºC unless otherwise noted) Parameter Peak pulse power dissipation w/ 10/1000 μs waveform(1) Peak pulse power dissipation w/ 10μs/50ms waveform(2) Steady state power dissipation lead length 0.375” (9.5mm), TL = 85ºC (6) Max. working stand-off voltage Peak forward surge current, 8.3ms single half sine-wave(3) Operating junction and storage temperature range Symbol PPPM PPPM PM(AV) VWM IFSM TJ, TSTG Limit 6000 2000 6.5 24 400 -65 to +185 Unit W W W V A ºC Electrical Characteristics (TA=25ºC unless otherwise noted) Max. DC reverse leakage current at Vwm = 24V Reverse Breakdown Voltage at 100m A TA = 25ºC TA = 150ºC TA = 25ºC min. TA = 25ºC max. TA = 150ºC min. TA = 150ºC max. Max. clamping voltage TA = 25ºC at Ipp = 90A (4) TA = 150ºC Max. instantaneous forward voltage at 100A(5) Note: (1) Non-repetitive current pulse, per Fig. 2, with a 10/1000μs waveform (2) Non-repetitive current pulse, per Fig. 5, with 10μs/50ms waveform (3) Measured on 8.3ms half sine-wave, or equivalent square wave, duty cycle = 4 pulses maximum V(BR) VC VF 1.0 50 26.7 32.6 29.6 36.7 40 45 1.8 μA (4) Measured on 80μs square pulse width (5) Measured on 300μs second square pulse...