CDBUR0145 Datasheet | Comchip Technology

Features Designed for mounting on small surface. Extremely thin/leadless package. Low leakage current. (I R =0.1u A typ.@V R =10V) Majority carrier conduction. 0.039(1.00) 0.031(0.80) 0603(1608) 0.071(1.80) 0.063(1.60) Mechanical data Case: 0603(1608) standard package, molded plastic. 0.018(0.45) Typ. 0.033(0.85) 0.027(0.70) Terminals: Gold plated, solderable per MIL-STD-750,method 2026. Polarity: Indicated by cathode band. Mounting position: Any Weight: 0.003 gram(approx.). Dimensions in inches and (millimeter) .. 0.028(0.70) Typ. Maximum Rating (at T A =25 C unless otherwise noted) Parameter Repetitive peak reverse voltage Reverse voltage Average forward current Forward current,surge peak Power Dissipation Sunction temperature Junction temperature Conditions Symbol Min Typ Max Unit V RRM VR IO 45 100 1000 150 -40 +125 +125 V V m A m A m W 8.3 ms single half sine-wave superimposed on rate load(JEDEC method) I FSM PD T STG Tj Electrical Characteristics (at T A =25 C unless otherwise noted) Parameter Forward voltage Reverse current Capacitance between terimnals V R = 10V Conditions I F = 100 m A DC Symbol Min Typ Max Unit VF IR CT 9 0.55 1 V u A p F F = 1 MHZ and 10 VDC reverse voltage REV:A QW-A1062 Page 1 SMD Schottky Barrier Diode SMD Diodes...