CDSF355 Datasheet | Comchip Technology

SMD Switching Diode CHIP .chip..tw High Speed Features Designed for mounting on small surface. High speed switching. High mounting capability, strong surge withstand, high reliability. Preliminary 1005(2512) 0.106(2.70) 0.098(2.50) 0.017(0.43) Typ Mechanical data Case: 1005(2512) standard package, molded plastic. Terminals: Solder plated, solderable per MIL-STD-750, method 2026. Polarity: Indicated by cathode band. Mounting position: Any. Weight: 0.005 gram (approximately) 0.008(R0.20) Typ. 0.055(1.40) 0.047(1.20) 0.040 (1.00) 0.031(0.80) Dimensions in inches and (millimeter) Maximum Rating ( at T A = 25 C unless otherwise noted ) Parameter Repetitive peak reverse voltage Reverse voltage Average forward current Forward current , surge peak Power Dissipation Storage temperature Junction temperature 8.3 ms single half sine-wave superimposed on rate load ( JEDEC method ) Conditions Symbol Min Typ Max Unit V RRM VR IO I FSM PD T STG Tj -55 -55 1000 300 +125 +125 90 80 100 V V m A m A m W C C Electrical Characteristics ( at T A = 25 C unless otherwise noted ) Parameter Forward voltage Reverse current V R = 80 V Conditions I F = 100 m A DC Symbol Min Typ Max Unit VF IR CT T rr 1.00 0.1 3 4 V u A p F n S Capacitance between terminals f =1MHz, and 1 VDC reverse voltage Reverse recovery time V R = 6V, I F = 10 m A, R L =50 ohms RDS0212001-A...