CDSS355 Datasheet | Comchip Technology

Features Designed for mounting on small surface. High speed switching. High mounting capability, strong surge withstand, high reliability. 0805(2012) 0.087(2.20) 0.079(2.00) 0.016(0.40) Typ Mechanical data Case: 0805(2012) standard package, molded plastic. Terminals: Solder plated, solderable per MIL-STD-750, method 2026. Polarity: Indicated by cathode band. Mounting position: Any. Weight: 0.0048 gram (approximately) 0.008(R0.20) Typ. 0.055(1.40) 0.047(1.20) 0.043 (1.10) 0.035(0.90) Dimensions in inches and (millimeter) Maximum Rating ( at T A = 25 C unless otherwise noted ) Parameter Repetitive peak reverse voltage Reverse voltage Average forward current Forward current , surge peak Power Dissipation Storage temperature Junction temperature 8.3 ms single half sine-wave superimposed on rate load ( JEDEC method ) Conditions Symbol Min Typ Max Unit V RRM VR IO I FSM PD T STG Tj -55 -55 1000 300 +125 +125 90 80 100 V V m A m A m W C C Electrical Characteristics ( at T A = 25 C unless otherwise noted ) Parameter Forward voltage Reverse current V R = 80 V Conditions I F = 100 m A DC Symbol Min Typ Max Unit VF IR CT T rr 1.00 0.1 3 4 V u A p F n S Capacitance between terminals f =1MHz, and 1 VDC reverse voltage Reverse recovery time V R = 6V, I F = 10 m A, R L =50 ohms RDS0208004-C Page 1 SMD Switching Diode CHIP .chip..tw RATING AND CHARACTERISTIC CURVES (CDSS355) Fig. 1 - Forward characteristics 1000 10u Fig. 2 - Reverse characteristics Forward current ( m A ) Reverse current ( A ) 125 C 1u 75...