CDSU4148 Datasheet | Comchip Technology

SMD Switching Diode CHIP .chip..tw High Speed (Lead-free Device) Features Designed for mounting on small surface. Extremely thin/leadless package. High mounting capability, strong surge withstand, high reliability. 0.039(1.00) 0.031(0.80) 0603(1608) 0.071(1.80) 0.063(1.60) Mechanical data Case: 0603 (1608) standard package, molded plastic. 0.033 (0.85) 0.027 (0.70) Terminals: Gold plated, solderable per MIL-STD-750, method 2026. Polarity: Indicated by cathode band. 0.010(0.25) Typ. 0.012 (0.30) Typ. Mounting position: Any. 0.014(0.35) Typ. Weight: 0.003 gram (approximately) Dimensions in inches and (millimeter) Maximum Rating ( at T A = 25 C unless otherwise noted ) Parameter Repetitive peak reverse voltage Reverse voltage Average forward current Forward current , surge peak Power Dissipation Storage temperature Junction temperature tp=1u S tp=1m S PD T STG Tj -40 -40 Conditions Symbol Min Typ Max Unit V RRM VR IO 4 I FSM 1 150 +125 +125 m W C C A 100 75 150 V V m A Electrical Characteristics ( at T A = 25 C unless otherwise noted ) Parameter Forward voltage Reverse current Capacitance between terminals Reverse recovery time V R = 20 V V R = 75 V f = 1MHz, and 0 VDC reverse voltage I F = I R = 10 m A, R L =100 ohms, irr = 1m...